With the rapid development of PCB products in the direction of ultra-thin, small components, high density and fine pitch.

Due to the characteristics of the wave soldering process, defects are most likely to occur in this process, such as pin short circuit, virtual soldering, missing soldering, braided soldering, etc.

The electronic plug-in manufacturing process has very strict requirements on the quality of products. For the manufacturing process of hundreds or even thousands of electronic plug-ins per minute, even a high product qualification rate of 1% means huge economic benefits.

For the SMT production process, with the increasing precision of the mounted components, the post-furnace AOI has become an indispensable and important member of the SMT production line.

With the development of higher density, smaller size, and more complex PCB hybrid technology for electronic assembly, the inspection of post-print quality with the naked eye is a thing of the past.