Semiconductor fine circuit detection

Key Parameter

Standard 2.5 μ M high resolution for precise detection of images, optional with higher resolution

25 megapixel industrial camera is adopted, with 31 megapixel, 65 megapixel and 150 megapixel options

It can detect the appearance of LTCC, ferrite, high-frequency laminated ceramic inductor, wafer, SIP package and other semiconductor materials

The visual inspection system supports offline programming, online debugging and AI intelligent re judgment

NG/OK automatic sorting and automatic laser waste removal

AOI Testing

Marble gantry structure design, equipped with high-precision linear motor module, to ensure the operation accuracy of X and Y axes, with the highest accuracy of ± 1 μ m

25 megapixel industrial camera, high-resolution telecentric lens, 0.2~2.5 μ M/pixel high resolution optional

Single sheet material detection CT ＜ 30s @ 200 * 200mm, CCD height can be automatically adjusted within ± 5mm

It can detect the effective area of 50 * 50~400 * 300mm, and output OK, NG, TBC (a certain proportion of the number of defective products exceeding the set value is the area to be confirmed, and the product will be grabbed by the manipulator and placed in the radium cutting module set to perform radium cutting)

It can detect various appearance defects, such as broken thread, burr, pinhole, foreign matter, notch, length, width, area, abnormity, etc

Software Algorithm

The optical detection software system with independent intellectual property rights, based on vector analysis algorithm rules, fusion logic or operation, brightness range, minimum span of brightness change, AI depth learning and other more than 30 advanced detection algorithms, deals with detection of various complex circuits and semiconductor parts

Support SPC statistical analysis function and SFC/MES connection of various production intelligent execution systems

Support AI intelligent retrial function

Support offline programming&online non-stop debugging function

Poor Detection

Laser Radium Cutting

The product detected by the image recognition system automatically performs judgment:

The blanking module automatically grabs the products without defects to the OK material box

The blanking module will automatically grab the products beyond the defect quantity or a certain percentage to the NG material box

If the number or percentage of defects tested is within the controllable range, the blanking module will automatically grab the product to the radium cutting area and execute automatic radium cutting

Application Area

Wafer

SIP Encapsulation

Inquiry online

0755-61519009/61519062


Vision System	Camera	25Mp	31Mp	65Mp	150Mp
	Lens	High resolution telecentric industrial lens
	Resolving Power	2.5μm	2.5μm	1.5μm/2.5μm	0.7μm/1μm/1.5μm
	Lamp-house	Monochrome light/multi-color tower light/backlight
	Platform	Multi station microporous ceramic platform
Laser	10WUltraviolet nanosecond/15WUltraviolet nanosecond/15WUltraviolet picosecond

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