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随着PCB产品也向着超薄型、小元件、高密度、细间距方向快速发展。
线路板上元器件组装密度提高，PCB的线宽、间距、焊盘越来越细小，已到微米级
人工目检的方式已满足不了，目前大多数工厂还在采用人工目视的检测方式
随着电子产品小型化及低能耗化的市场需求越来越旺盛，电子元器件向小型化发展步伐越来越快
此外人容易疲劳和受情绪影响，相对于人工目检而言，机器具有更高的稳定性、可重复性和更高的精准度
线路板上元器件组装密度提高，PCB的线宽、间距、焊盘越来越细小，已到微米级
随着PCB产品也向着超薄型、小元件、高密度、细间距方向快速发展。
随着PCB产品也向着超薄型、小元件、高密度、细间距方向快速发展。
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ISO900 certificate
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SPI CE certification
Engraving machine CE certification
Member of Shenzhen Science and Technology Association
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4.0 smart factory demonstration base collaborative production partners
Red sail Award for industrial design
SMT Trade Association Special Contribution Award
Vice president unit
China SMT innovation achievement award
SMT certificate of honor
Certificate of excellent entrepreneur of general manager
Customer recognition Award
China's most influential copyright enterprise
Shenzhen China Mobile Phone Manufacturing Automation Exhibition most attention Award
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